Integrated circuit with improved test capability via reduced pin count

ABSTRACT

An integrated circuit that supports testing of multiple pads via a subset of these pads includes at least two sections. Each section has multiple pads and multiple test access circuits coupled to these pads. For each section, one pad is designated as a primary pad and the remaining pads are designated as secondary pads. For each section, the test access circuits couple the secondary pads to the primary pad such that all of the pads in the section can be tested by probing just the primary pad. Each test access circuit may be implemented with a simple switch. A controller generates a set of control signals for the test access circuits in all sections. These control signals enable and disable the test access circuits such that all of the sections can be tested in parallel, and the pads in each section can be tested in a sequential order.

BACKGROUND

I. Field

The present disclosure relates generally to electronics, and morespecifically to techniques for testing an integrated circuit.

II. Background

Continual improvement in integrated circuit (IC) fabrication technologyhas enabled more and more complicated integrated circuits to befabricated for a variety of applications. For example, an applicationspecific integrated circuit (ASIC) may include one or more processors,memories, and other processing units. The integration of all of thesecircuit blocks on a single integrated circuit reduces cost and improvesreliability.

Integrated circuits are typically manufactured via a complicatedfabrication and testing process. After fabrication, the integratedcircuit devices (or IC dies) are typically tested at the wafer level.Devices that pass wafer test are then packaged and tested at the finalor package level. Devices that fail either wafer or final test arerejected.

Manufacturing resources are expended to package and final test eachdevice that passes wafer test. Hence, it is desirable to identify asmany defective devices as possible during the wafer test so that thesedevices are not unnecessarily packaged and final tested. To achievethis, a series of tests is typically performed at the wafer level. Thesetests often include a direct current (DC) leakage test that checks thepads on each device to make sure that these pads are not shorted oropened.

Wafer testing adds cost to the manufacturing process. Hence, a low-costwafer probe scheme may be utilized, and this scheme may perform only alimited number of tests at the wafer level. The remaining tests (e.g.,the pad DC leakage test) may be skipped at the wafer level and deferreduntil the package level. Each wafer level test that is deferredpotentially results in defective devices (or test escapes) passing thewafer level testing. These defective devices would then be packaged andfinal tested, and unnecessary costs would be incurred to package andfinal test these defective devices.

There is therefore a need in the art for techniques to test anintegrated circuit in a cost effective manner.

SUMMARY

Integrated circuits that support testing of multiple pads via a subsetof these pads are described herein. This enhanced test capability allowsfor efficient testing at the wafer level, which can improve yield andlower manufacturing cost.

In an embodiment, an integrated circuit includes at least two sections.Each section has multiple pads and multiple test access circuits coupledto these pads. For each section, one pad is designated as a primary padand the remaining pads are designated as secondary pads. For eachsection, the test access circuits electrically couple the secondary padsto the primary pad such that all of the pads in the section can betested by probing just the primary pad. Each test access circuit may beimplemented with a simple switch. A controller generates a set ofcontrol signals for all sections. These control signals enable anddisable the test access circuits such that all of the sections can betested in parallel, and the pads in each section can be tested in asequential order. For example, if the integrated circuit has K sectionsand each section has N pads, then all K×N pads on the integrated circuitmay be tested in N iterations, with a different set of K pads in the Ksections being tested in each iteration.

Various aspects and embodiments of the invention are described infurther detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

The features and nature of the present invention will become moreapparent from the detailed description set forth below when taken inconjunction with the drawings in which like reference charactersidentify correspondingly throughout.

FIG. 1 shows a conventional integrated circuit.

FIG. 2 shows an integrated circuit that supports testing of multiplepads via a single pad.

FIG. 3 shows an integrated circuit with multiple pad sections.

FIG. 4 shows an integrated circuit that supports testing of all testablepads using a small subset of these pads.

FIG. 5 shows a configuration for testing an integrated circuit.

FIG. 6 shows a block diagram of a wireless device.

FIG. 7 shows a process for testing an IC device.

DETAILED DESCRIPTION

The word “exemplary” is used herein to mean “serving as an example,instance, or illustration.” Any embodiment or design described herein as“exemplary” is not necessarily to be construed as preferred oradvantageous over other embodiments or designs.

FIG. 1 shows an embodiment of an integrated circuit 100 with multiple(N) input/output (I/O) pads 110 a through 110 n. Pads 110 may be locatedanywhere on an IC die and may even be underneath the die. Each pad 110provides interconnection to circuitry internal to integrated circuit100. Each pad 110 is associated with an I/O circuit 120 that providessignal drive and buffering for that pad. Within each I/O circuit 120, anoutput buffer 122 provides signal drive for an output signal being sentfrom the pad, and an input buffer 124 provides buffering for an inputsignal being received via the pad. Each pad 110 may be electricallycoupled to an external pin of an IC package via a bond wire, a leadframe finger, and so on (not shown in FIG. 1). A pad may also beelectrically coupled to another pad on another integrated circuit thatmay be mounted either on top of or side-by-side with integrated circuit100. For simplicity, FIG. 1 shows a column of pads 110 for only one sideof integrated circuit 100. The other sides of integrated circuit 100 mayalso have pads. Furthermore, integrated circuit 100 may include bumps,which are metallization over contact areas.

An integrated circuit device is often tested at both the wafer level(while the device is a die on a wafer) and the package level (after thedevice has been assembled inside an IC package). In general, anintegrated circuit may be tested at various stages of an assemblyprocess including inter-die testing prior to sawing and testing an arrayof pads or under-bump metallization on the top or bottom of a die.Thorough testing of the device may require access to all of the testablepads on the device. For example, each pad may be tested for DC leakageto ensure that the pad is not shorted or opened. This may be achieved by(1) applying a test voltage to the pad and measuring the current flowingthrough the pad or (2) forcing a current and measuring the voltage. ESDdiodes may also be measured with a power supply on a test controller. Ingeneral, for DC testing, a Parametric/Precision Measurement Unit (PMU)may be used to (1) force a voltage on a pad and measure the currentflowing through the pad or (2) force a current through the pad andmeasure the voltage on the pad.

The DC tests and/or slow alternating current (AC) tests may be performedat the wafer level and/or the package level. The DC tests may include DCleakage test as well as other tests. It is desirable to perform the DCtests and/or slow AC tests at the wafer level in order to avoidpackaging and testing defective devices, e.g., with opened and/orshorted pads. However, individually probing each pad on each device forthe DC tests and/or slow AC tests at the wafer level can extend testtime and increase manufacturing cost.

FIG. 2 shows an embodiment of an integrated circuit 200 that supportstesting of multiple pads via a single pad. Integrated circuit 200includes multiple (N) pads 210 a through 210 n, multiple (N) I/Ocircuits 220 a through 220 n, and multiple (N) test access circuits 230a through 230 n. Each pad 210 couples to a respective I/O circuit 220and further to a respective test access circuit 230. In the embodimentshown in FIG. 2, each I/O circuit 220 includes an output buffer 222 thatprovides signal drive for the associated pad 210 and an input buffer 224that provides input buffering for the pad. Each test access circuit 230provides access to the associated pad 210 for testing purposes. Ingeneral, a pad may be coupled to an input buffer or an output buffer, orboth input and output buffers. A pad may also be associated withpull-ups, pull-downs, and/or keepers, which may also be tested via theassociated test access circuit.

In the embodiment shown in FIG. 2, test access circuit 230 a includes aswitch 232 a and an inverter 238 a. Switch 232 a is formed with anN-channel field effect transistor (N-FET) 234 a and a P-channel FET(P-FET) 236 a. The sources of N-FET 234 a and P-FET 236 a are coupledtogether and further to the associated pad 210 a. The drains of N-FET234 a and P-FET 236 a are coupled together and further to a common nodeor connection 242. Inverter 238 a has its input coupled to the gate ofN-FET 234 a and its output coupled to the gate of P-FET 236 a. The gateof N-FET 234 a is driven by an Sa control signal, and the gate of P-FET236 a is driven by an inverted Sa control signal from inverter 238 a.Switch 232 a is either closed or opened by the Sa control signal.Inverter 238 a may also drive N-FET 234 a instead of P-FET 236 a. Testaccess circuit 230 a may also be implemented in other manners.

Test access circuits 230 b through 230 n are each coupled in the samemanner as test access circuit 230 a. Switches 232 a through 232 n withintest access circuits 230 a through 230 n, respectively, have one endcoupled to common node 242 and the other end coupled to pads 210 athrough 210 n, respectively.

A controller 250 generates the Sa through Sn control signals forswitches 232 a through 232 n within test access circuits 230 a through230 n, respectively. Controller 250 may receive a Mode signal thatindicates whether integrated circuit 200 is operating in a test mode. Inthe test mode, controller 250 generates the control signals in a mannerto enable testing of all of the pads.

The structure shown in FIG. 2 allows pads 210 a through 210 n to betested by probing a single pad. The pad on which a test probe is appliedis called a primary pad. The remaining pads that are not directly probedare called secondary pads. For clarity, the following descriptionassumes that pad 210 a is the primary pad, and pad 210 b through 210 nare secondary pads.

For DC testing (e.g., DC leakage testing), integrated circuit 200 isplaced in the test mode, and a test probe is applied to primary pad 210a. To test I/O circuit 220 a for primary pad 210, switches 232 a through232 n are turned off by bringing the Sa through Sn control signals tologic low. Pad 210 a may then be tested in the normal manner since pads210 b through 210 n are disconnected from pad 210 a with switches 232 athrough 232 n turned off. If pad 210 a is defective (e.g., opened orshorted), then the DC leakage test terminates and the IC device isrejected. Otherwise, if pad 210 a is non-defective, then the remainingpads 210 b through 210 n may be tested one at a time.

To test a secondary pad 210 y, where yε{b, c, . . . , n}, switch 232 ais turned on by bringing the Sa control signal to logic high, switch 232y is turned on by bringing the Sy control signal to logic high, and allother switches 232 are turned off by bringing their control signals tologic low. The test signal is applied to primary pad 210 a by the testprobe, routed via switches 232 a and 232 y, and provided to pad 210 y.Since pad 210 a is known to be non-defective, only pad 210 y iseffectively tested.

Primary pad 210 a may be tested directly in the normal manner. Secondarypads 210 b through 210 n may be individually tested via test accesscircuit 230 a in combination with test access circuits 230 b through 230n, respectively. Test access circuits 230 a through 230 n are circuitrythat connects the pad being probed by the test probe (primary pad 210 a)to the pad being tested (secondary pad 210 y, where yε{b, c, . . . ,n}).

FIG. 2 shows a specific embodiment for interconnecting the test accesscircuits for testing the pads on the integrated circuit. This embodimentuses a “star” configuration with common node 242 being the center of thestar, pads 210 a through 210 n being the end points of the star, andeach pad being coupled to the center node via the associated test accesscircuit. In another embodiment, the test access circuits are coupled ina “daisy chain” configuration. For this configuration, each test accesscircuit couples between a different pair of pads. For example, testaccess circuit 230 a may be coupled between pads 210 a and 210 b, testaccess circuit 210 b may be coupled between pads 210 b and 210 c, and soon, and test access circuit 210 m may be coupled between pads 210 m and210 n. Each pad receives the test signal via a preceding test accesscircuit and/or provides the test signal via a subsequent test accesscircuit. All test access circuits are disabled to test primary pad 210,test access circuit 230 a is enabled to test secondary pad 210 b, testaccess circuits 230 a and 230 b are enabled to test secondary pad 210 c,and so on. A combination of “star” and “daisy chain” circuits may alsobe used on the same integrated circuit. Simulation, characterization,and/or other forms of circuit analysis may be used to determine andassign parametric offsets. These parametric offsets may be used toincrease the accuracy of the measurements for either the “star” or“daisy chain” configuration. For clarity, the star configuration is usedfor much of the description herein.

FIG. 3 shows an embodiment of an integrated circuit 300 that supportstesting of multiple pads using a subset of these pads. Within integratedcircuit 300, the pads are arranged in multiple (M) sections 302 athrough 302 m. Each section 302 includes multiple (N) pads 310 a through310 n, multiple (N) I/O circuits 320 a through 320 n, and multiple (N)test access circuits (ckts) 330 a through 330 n, one test access circuitfor each pad. For each section 302, test access circuits 320 a through320 n may be coupled to pads 310 a through 310 n in the manner describedabove for integrated circuit 200 in FIG. 2. For each section 302, onepad (e.g., pad 310 a) is designated as the primary pad to which a testprobe is applied, and the remaining pads (e.g., pads 310 b through 310n) are designated as secondary pads that are not directly probed. All ofthe pads in each sector may be tested by probing only the primary padfor the section. A controller 350 generates the control signals toenable and disable the test access circuits in all M sections 302 athrough 302 m. In the embodiment shown in FIG. 3, any number of pads ina group (e.g., pads 310 b through 310 n) may be tested simultaneously.This simultaneous testing may be useful when correlation to single padtesting is difficult to achieve with a larger group.

In general, an integrated circuit may include any number of sections,and each section may include any number of pads. The sections mayinclude the same or different numbers of pads. Each section includes oneprimary pad, where any pad in the section may be designated as theprimary pad. The primary pads for all of the sections may be selectedbased on various criteria such as, e.g., layout considerations, testingconsiderations, and so on. For example, pads on one side of theintegrated circuit may be more accessible, and these pads may beselected as the primary pads. As another example, other tests may beperformed on some I/O circuits or pads, and these pads would not beselected as the primary pads.

For integrated circuit 300, the M sections 302 a through 302 m may betested in parallel by applying M test probes to the M primary pads forthe M sections. One test probe may be applied to the primary pad (e.g.,pad 310 a) for each section and used to sequentially test all of thepads in that section. The pads in each section may be tested asdescribed above for FIG. 2. The control signals for each section areappropriately set to enable testing of each pad. M may be a small subsetof all of the pads on the integrated circuit. In this case, wafertesting may be performed with a reduced number of test probes, which maysubstantially reduce test cost. The parallel testing of the M sectionscan reduce test time.

FIG. 4 shows an embodiment of an integrated circuit 400 that supportstesting of all testable pads using a subset of these pads. Integratedcircuit 400 includes multiple (K) sections 402 a through 402 k. Eachsection 402 includes multiple (N) pads 410 a through 410 n, multiple (N)I/O circuits that are represented by buffers 420 a through 420 n, andmultiple (N) test access circuits that are represented by N-FETs 430 athrough 430 n, one N-FET for each pad. For simplicity, each section 402is represented by a dashed box that includes all pads, buffers, andN-FETs for that section except for pad 410 a, buffer 420 a, and N-FET430 a. For each section 402, N-FETs 430 a through 430 n have theirsources coupled to pads 410 a through 410 n, respectively, their gatesreceiving the Sa through Sn control signals, respectively, and theirdrains coupled to a common node or connection. For each section 402, pad410 a is designated as the primary pad to which a test probe is appliedin order to test pads 410 a through 410 n in that section.

For the embodiment shown in FIG. 4, the same set of Sa through Sncontrol signals is used for all K sections 402 a through 402 k. The Sacontrol signal is coupled to N-FETs 430 a in all K sections, the Sbcontrol signal is coupled to N-FETs 430 b in all K sections, and so on,and the Sn control signal is coupled to N-FETs 430 n in all K sections.A controller 450 generates the Sa through Sn control signals for theN-FETs.

Table 1 shows an exemplary test sequence for testing the pads withinintegrated circuit 400. In step 1, all K control signals Sa through Snare at logic low (or Off), all N-FETs 430 are turned off, and I/Ocircuits 420 a in all K sections are tested via pads 430 a. In step 2,the Sa and Sb control signals are at logic high (or On), the Sc throughSn control signals are at logic low, N-FETs 430 a and 430 b are turnedon and N-FETs 430 c through 430 n are turned off in all K sections, andI/O circuits 420 b in all K sections are tested via pads 430 a and 430b. In step 3, the Sa and Sc control signals are at logic high, the Sband Sd through Sn control signals are at logic low, N-FETs 430 a and 430c are turned on and N-FETs 430 b and 430 d through 430 n are turned offin all K sections, and I/O circuits 420 c in all K sections are testedvia pads 430 a and 430 c. The remaining I/O circuits are tested insimilar manner. TABLE 1 Step On Off Description 1 Sa to Sn Test pad 410aand I/O circuit 420a via pad 430a. 2 Sa and Sb Sc to Sn Test pad 410band I/O circuit 420b via pads 430a and 430b. 3 Sa and Sc Sb and Test pad410c and I/O Sd to Sn circuit 420c via pads 430a and 430c. . . . . . . .. . . . . N Sa and Sn Sb to Sm Test pad 410n and I/O circuit 420n viapads 430a and 430n.

For the embodiment shown in FIG. 4, K pads and K I/O circuits in the Ksections are tested in parallel via the K primary pads and the Ksecondary pads for these I/O circuits. All pads and I/O circuits may betested in N iterations.

In certain instances, only some of the pads on an integrated circuit maybe accessible for testing. For example, an IC device may be mounted ontop of another IC device in a stacked die configuration, and only aportion of the IC device on the bottom may be accessible for testing. Inthis case, the primary pads may be selected based on accessibility. Forthe embodiment shown in FIG. 4, only the pads on the right side ofintegrated circuit 400 may be accessible. These pads may then be used totest other pads located in other parts of the integrated circuit.

FIGS. 2 through 4 show several embodiments of integrated circuits thatsupport testing of multiple pads via a subset of these pads. FIGS. 2through 4 also show specific embodiments for interconnecting the padsfor testing. The pads may also be interconnected in other manners andusing other types of test access circuits.

FIG. 5 shows an embodiment of a test configuration 502 for testing thepads and I/O circuits within an integrated circuit 500. For clarity,only one pad 510, one I/O circuit 520, and one test access circuit 530are shown for integrated circuit 500. Test configuration 502 includes aParametric/Precision Measurement Unit (PMU) 550 having two test sections560 and 570. Section 560 includes a current source 562 that generatesand provides a programmable current via a line 566 and a voltagemeasurement unit 564 that measures the voltage on line 566. Section 570includes a voltage source 572 that generates and provides a programmablevoltage via a line 576 and a current measurement unit 574 that measuresthe current flowing through line 576. A switch 568 couples test section560 to a test probe 580, and a switch 578 couples test section 570 tothe test probe. PMU 550 may be coupled to pad 510 via test probe 580.

Test configuration 502 in FIG. 5 may be used for various DC parametrictests such as, for example, DC leakage test, input level test, outputlevel test, keeper strength test, pull-up/pull-down strength test, andso on. For the DC leakage test, test section 570 is enabled and appliesa voltage (a high voltage V_(DD) or a low voltage V_(SS)) to pad 510.Current measurement unit 574 then measures the current flowing throughpad 510 for the applied voltage level. For the input level test, testsection 570 is enabled and applies different voltages (e.g., voltagesthat increase in small increments) to pad 510, and the output of I/Ocircuit 520 is monitored to determine (1) the minimum input voltage(VIH_(min)) that is recognized as logic high by integrated circuit 500and (2) the maximum input voltage (VIL_(max)) that is recognized aslogic low by integrated circuit 500. For the output level test, I/Ocircuit 520 is configured to output logic low (or logic high), testsection 560 is enabled, current source 562 is configured to sink (orsource) a specified amount of current, and voltage measurement unit 564measures the output voltage for logic low (or logic high). The keeperstrength test measures the amount of current needed to change the stateof an I/O circuit whose value is retained by a keeper. Thepull-up/pull-down strength test measures the current when logic low orhigh is applied on a pad that is pulled to a particular state.

DC tests may be performed on multiple pads via a subset of these pads,e.g., using test configuration 502 in FIG. 5. Alternating current (AC)tests may also be performed on multiple pads via a subset of these pads.The test access circuits may be controlled such that only one I/Ocircuit in each section is AC tested via the primary pad and possibly asecondary pad at any given moment. The AC testing may be performed in amanner (e.g., at a lower signal frequency or a slower clock rate) toaccount for parasitic capacitance and/or resistance that may result fromlong path lengths of inter-pad connections, routes, and nets due to thetest signal being applied via multiple pads to the I/O circuit undertest. A signal may also be broadcast from the probed pad and captured atinput receiver registers of multiple pads in a group.

The test capability described herein may be used for various types ofintegrated circuits such as, for example, an ASIC, a digital signalprocessor (DSP), a reduced instruction set computer (RISC), a digitalsignal processing device (DSPD), a programmable logic device (PLD), afield programmable gate array (FPGA), a processor, a controller, amicro-controller, a microprocessor, a memory device, and so on. Thememory device may be a random access memory (RAM), a static RAM (SRAM),a dynamic RAM (DRAM), a synchronous DRAM (SDRAM), a read only memory(ROM), a Flash memory, and so. The integrated circuit and testcapability may be used for various applications such as communication,networking, computing, consumer electronics, and so on.

FIG. 6 shows a block diagram of a wireless device 600 that includes oneor more integrated circuits having the test capability described herein.Wireless device 600 may be a cellular phone, a terminal, a handset, orsome other apparatus. Wireless device 600 may be capable ofcommunicating with a Code Division Multiple Access (CDMA) system, a TimeDivision Multiple Access (TDMA) system, a Global System for MobileCommunications (GSM) system, an Advanced Mobile Phone System (AMPS)system, a wireless local area network (WLAN), and so on. A CDMA systemmay implement Wideband-CDMA (W-CDMA), cdma2000, or some other radioaccess technology.

Wireless device 600 provides bi-directional communication via a receivepath and a transmit path. For the receive path, forward link signalstransmitted by base stations are received by an antenna 612, routedthrough a duplexer (D) 614, and provided to a receiver unit (RCVR) 616.Receiver unit 616 conditions and digitizes the received signal andprovides input samples to a digital section 620 for further processing.For the transmit path, a transmitter unit (TMTR) 618 receives fromdigital section 620 data to be transmitted, processes and conditions thedata, and generates a reverse link signal, which is routed throughduplexer 614 and transmitted via antenna 612 to the base stations.

Digital section 620 includes various processing units and supportcircuitry such as, for example, a DSP 622, a RISC 624, a main controller626, an internal memory 628, and a test controller 630. DSP 622 and/orRISC 624 may implement a modem processor, a video processor, a graphicsprocessor, and/or other processors for other applications. Maincontroller 626 directs the operation of various units in wireless device600. Internal memory 628 stores program codes and/or data used byvarious units within digital section 620. Test controller 630facilitates testing of digital section 620 and may implement any of thetesting techniques described above. A main memory 632 provides massstorage for wireless device 600 and may be a RAM, an SRAM, a DRAM, anSDRAM, and so on. A non-volatile memory 634 provides non-volatilestorage and may be a Flash memory, a ROM, and so on.

Digital section 620 may be implemented as an ASIC. Memories 632 and 634may be implemented as memory ICs that are external to the ASIC. The ASICand/or memory ICs may be designed with the test capability describedherein.

The integrated circuits described herein may be implemented with variousIC process technologies such as complementary metal oxide semiconductor(CMOS), N-channel MOS (N-MOS), P-channel MOS (P-MOS), bipolar-CMOS(Bi-CMOS), and so on. CMOS technology can fabricate both N-FET and P-FETdevices on the same die, whereas N-MOS technology can only fabricateN-FET devices and P-MOS technology can only fabricate P-FET devices. Thetesting techniques described herein may be used in any technology. Theswitches described herein may be implemented using any device associatedwith a switch in a given technology. The devices may include but are notlimited to a CMOS pass gate, an N-FET, a P-FET, a fuse, and so on.

FIG. 7 shows a process 700 for testing multiple pads on an IC device byprobing a single pad on the IC device. A test probe is applied to afirst pad (the primary pad) on the IC device (block 710). A test signalis provided via the test probe to the first pad (block 712). The firstpad is tested with the test probe and the test signal applied to thefirst pad (block 714). A voltage may be provided via the test probe tothe first pad, and the current flowing through the first pad may bemeasured with the test probe. Alternatively, a current may be providedvia the test probe to the first pad, and the voltage at the first padmay be measured with the test probe. Other tests with other test signalsmay also be performed.

The test signal is then provided to a second pad via the test probe andthe first pad (block 716). The second pad is then tested with the testprobe applied to the first pad and the test signal provided to thesecond pad via the test probe and the first pad (block 718). Eachremaining pad may be tested by repeating blocks 716 and 718. For eachpad to be tested, the test access circuits are appropriately enabled anddisabled so that the pad under test is electrically coupled to the testprobe that is applied to the first pad.

The previous description of the disclosed embodiments is provided toenable any person skilled in the art to make or use the presentinvention. Various modifications to these embodiments will be readilyapparent to those skilled in the art, and the generic principles definedherein may be applied to other embodiments without departing from thespirit or scope of the invention. Thus, the present invention is notintended to be limited to the embodiments shown herein but is to beaccorded the widest scope consistent with the principles and novelfeatures disclosed herein.

1. An integrated circuit comprising: a plurality of pads with one pad designated as a primary pad and remaining pads designated as secondary pads; and a plurality of test access circuits coupled to the plurality of pads and operable to couple the secondary pads to the primary pad such that each of the plurality of pads can be tested by probing the primary pad.
 2. The integrated circuit of claim 1, wherein the plurality of test access circuits are coupled to a common node, and wherein each test access circuit is further coupled to an associated pad.
 3. The integrated circuit of claim 2, wherein the plurality of test access circuits are configured such that the primary pad is tested by disabling a test access circuit for the primary pad.
 4. The integrated circuit of claim 3, wherein the plurality of test access circuits are further configured such that each secondary pad is tested by enabling the test access circuit for the primary pad, enabling a test access circuit for the secondary pad being tested, and disabling all remaining test access circuits.
 5. The integrated circuit of claim 1, wherein each test access circuit is coupled between a different pair of pads among the plurality of pads.
 6. The integrated circuit of claim 1, wherein the primary pad is configured to receive a test signal for direct current (DC) testing or slow alternating current (AC) testing of the plurality of pads.
 7. The integrated circuit of claim 2, wherein each test access circuit among the plurality of test access circuits comprises a switch coupled between the common node and a pad associated with the test access circuit.
 8. The integrated circuit of claim 7, wherein the switch for each test access circuit comprises at least one field effect transistor (FET).
 9. The integrated circuit of claim 1, further comprising: a controller operative to generate a plurality of control signals for the plurality of test access circuits.
 10. The integrated circuit of claim 9, wherein the controller is operative to generate the plurality of control signals to test the plurality of pads in a sequential order.
 11. The integrated circuit of claim 1, wherein the plurality of test access circuits are fabricated with complementary metal oxide semiconductor (CMOS).
 12. An integrated circuit comprising: at least two sections, each section comprising a plurality of pads and a plurality of test access circuits coupled to the plurality of pads, wherein for each section one pad is designated as a primary pad and remaining pads are designated as secondary pads, and wherein for each section the plurality of test access circuits are operable to couple the secondary pads to the primary pad such that each of the plurality of pads can be tested by probing the primary pad.
 13. The integrated circuit of claim 12, further comprising: a controller operative to generate a plurality of control signals for the plurality of test access circuits in each section, one control signal for each test access circuit, wherein the plurality of control signals are used for all of the at least two sections.
 14. The integrated circuit of claim 12, further comprising: a controller operative to generate a plurality of control signals to test the plurality of pads in each section in a sequential order.
 15. The integrated circuit of claim 12, wherein at least two pads in the at least two sections are tested in parallel.
 16. The integrated circuit of claim 12, wherein at least two primary pads for the at least two sections are located on one side of the integrated circuit.
 17. A method of testing an integrated circuit (IC) device, comprising: applying a test probe to a first pad on the IC device; providing a test signal via the test probe to the first pad; testing the first pad with the test probe and the test signal applied to the first pad; providing the test signal to a second pad via the test probe and the first pad; and testing the second pad with the test probe applied to the first pad and the test signal provided to the second pad via the test probe and the first pad.
 18. The method of claim 17, further comprising: providing the test signal to a third pad via the test probe and the first pad; and testing the third pad with the test probe applied to the first pad and the test signal provided to the third pad via the test probe and the first pad.
 19. The method of claim 17, wherein the providing the test signal via the test probe to the first pad comprises providing a voltage via the test probe to the first pad, and wherein the testing the first pad comprises measuring a current flowing through the first pad with the test probe.
 20. The method of claim 17, wherein the providing the test signal via the test probe to the first pad comprises providing a current via the test probe to the first pad, and wherein the testing the first pad comprises measuring a voltage at the first pad with the test probe.
 21. An apparatus comprising: means for applying a test probe to a first pad on an integrated circuit (IC) device; means for providing a test signal via the test probe to the first pad; means for testing the first pad with the test probe and the test signal applied to the first pad; means for providing the test signal to a second pad via the test probe and the first pad; and means for testing the second pad with the test probe applied to the first pad and the test signal provided to the second pad via the test probe and the first pad.
 22. The apparatus of claim 21, wherein the means for providing the test signal via the test probe to the first pad comprises means for providing a voltage via the test probe to the first pad, and wherein the means for testing the first pad comprises means for measuring a current flowing through the first pad with the test probe.
 23. The apparatus of claim 21, wherein the means for providing the test signal via the test probe to the first pad comprises means for providing a current via the test probe to the first pad, and wherein the means for testing the first pad comprises means for measuring a voltage at the first pad with the test probe. 